On January 31, 2021, Pu, Zejun; Xia, Jialing; Liu, Xueyu; Wang, Qi; Liu, Jingyue; He, Xiaohang; Zhong, Jiachun published an article.HPLC of Formula: 80-07-9 The title of the article was Novel polyethersulfone dielectric films with high temperature resistance, intrinsic low dielectric constant and low dielectric loss. And the article contained the following:
In this work, a series of fluorene-containing fluorinated polyethersulfone (PES-6AF/BHPF) copolymers with high temperature resistance and intrinsic low dielec. constant (low-ε) have been designed and synthesized from 4,4′-dichlorophenyl sulfone (DCS) and polyphenol. The performance of obtained PES-6AF/BHPF can be controlled and optimized by controlling the copolymers structure. The thermal and dielec. properties of PES-6AF/BHPF were evaluated comprehensively. The obtained PES-6AF/BHPF copolymers show high glass transition temperatures (Tg) ranging from 200 to 260 °C, and 5% weight loss temperatures (Td5%) is stable up to 500 °C. The ε value of PES-6AF/BHPF-0% and PES-6AF/BHPF-100% are as low as 2.1 and 2.3, and the loss tangent (tan δ) are only 0.0088 and 0.003 at 1 kHz, resp. In addition, all of PES-6AF/BHPF films show good stability of dielec. properties in high temperature conditions. More importantly, the PES-6AF/BHPF copolymers are soluble in common solvents (such as DMAc, NMP, DMF, THF). The PES-6AF/BHPF copolymers are amorphous and can be easily cast into transparent and flexible films with tensile strength of 62-74 MPa and an elongation at break of 13.3-15.8%. The outstanding comprehensive properties made it possible to be the most promising polymer candidates for high-performance interlayer dielecs. The experimental process involved the reaction of 4,4′-Sulfonylbis(chlorobenzene)(cas: 80-07-9).HPLC of Formula: 80-07-9
The Article related to polyethersulfone dielec film temperature resistance loss, Placeholder for records without volume info and other aspects.HPLC of Formula: 80-07-9
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