Dow, Wei-Ping published the artcileCopper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers, Formula: C22H23ClN4, the publication is Journal of the Electrochemical Society (2009), 156(8), D314-D320, database is CAplus.
Microvia filling by Cu electroplating was carried out using a plating bath containing a suppressor and a leveler without an accelerator. The required accelerator was adsorbed onto the Cu seed layer of the microvia in a predipping bath before the filling plating. This pretreatment is similar to the self-assembled monolayer of thiol mols. that forms on a Cu surface. The suppressor was poly(ethylene glycol) (PEG), and 5 levelers, namely, Janus green B, diazine black, methylene violet, safranine O, and Alcian blue, were employed to screen for the best plating formula suitable for a plating process in which no accelerator was present in the plating solution The thiol mol. employed in this work was 3-mercapto-1-propanesulfonate (MPS). The electrochem. behaviors of various plating formulas were characterized using a galvanostatic measurement on a Cu electrode at different rotating speeds. The MPS adlayer is transferable onto the surface of the Cu deposit and can be displaced by the PEG-Cl-leveler. The displacement rate depends on the mol. structure of the added leveler. This plating process has the potential to greatly reduce the plating time of microvia filling.
Journal of the Electrochemical Society published new progress about 4569-86-2. 4569-86-2 belongs to chlorides-buliding-blocks, auxiliary class Other Aromatic Heterocyclic,Salt,Amine,Benzene, name is 3-Amino-7-(diethylamino)-5-phenylphenazin-5-ium chloride, and the molecular formula is C22H23ClN4, Formula: C22H23ClN4.
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