On January 5, 2011, Xu, Shumin; Liu, Jianguang; Yang, Xiangkui; Ma, Xuewu; Song, Zhaoxia published a patent.Computed Properties of 4569-86-2 The title of the patent was Method for surface treatment of pink copper foil used for high-grade FR-4 copper-clad laminate. And the patent contained the following:
The title method comprises the steps of: using 12-70μm high-temperature high-ductility copper foil as cathode, running at 25.0±0.1m/min to roughen the copper foil surface and solidify fractal electrodeposited tubercular copper, forming a layer of nanoscale Cu alloy via electrodeposition, then depositing a layer of nanoscale Zn via electrodeposition, deactivating with basic chromate, and coating with a layer of silane coupling agent. An organic additive containing nitrogen heterocyclic ring is used in the electrodeposition of the Cu-N alloy whisker, to improve the appearance and corrosion resistance after treatment. The treated pink copper foil has the advantages of high oxidation resistance at normal temperature and high temperature, high plating layer diffusion resistance, high corrosion resistance, high etching resistance, high stripping resistance, and high high-temperature conversion resistance. The experimental process involved the reaction of 3-Amino-7-(diethylamino)-5-phenylphenazin-5-ium chloride(cas: 4569-86-2).Computed Properties of 4569-86-2
The Article related to laminate pink copper foil surface treatment electrodeposition, Nonferrous Metals and Alloys: Surface Treatment, Metallic and Nonmetallic Coating, Sealing, Cleaning, Polishing, Etching, and Pickling and other aspects.Computed Properties of 4569-86-2
Referemce:
Chloride – Wikipedia,
Chlorides – an overview | ScienceDirect Topics